Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...
The construction industry has a love-hate relationship with technology. Some are wary of any new software/hardware the boss brings back from a convention or trade show. In fact, much of this software ...
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