Design And Reuse

Toshiba to accelerate semiconductor design innovation with Siemens’ EDA software

Toshiba has introduced Siemens’ EDA tools to advance semiconductor design sophistication and accelerate development speed and we have begun trials to strengthen our design environment using these ...
Business Wire

SpringSoft Unveils New VIA Exchange for Development of Custom Applications with Verdi Debug System

HSINCHU, Taiwan--(BUSINESS WIRE)--SpringSoft, Inc., a global supplier of specialized IC design software, today launched the Verdi Interoperability Apps (VIA) Exchange, an open platform for creating ...
Electronic Specifier

Toshiba to accelerate semiconductor design innovation

Siemens has introduced Siemens’ electronic design automation software to enhance its power devices and analogue semiconductor ...
Electronic Specifier

Certus Semiconductor adopts AI-powered Solido

Certus has adopted Solido software for custom IC design to accelerate development of IO and ESD library solutions.
Electronic Design

Coventor Debuts MEMS Plus IC Co-Design Software

November 18, 2012. Coventor Inc., a supplier of design-automation software for developing micro-electromechanical systems (MEMS), has introduced the MEMS+ 3.0 design platform, the latest version of ...
EDN

IC verification tool addresses design complexity, productivity gap

A new software combines connectivity, scalability and data-driven artificial intelligence (AI) capabilities to push the boundaries of the IC verification process and make chip design teams more ...
Digi Times

Taiwan's IC design houses under growing pressure as generative AI rewrites the game

Generative AI is making its way into edge devices: though there remain bottlenecks to overcome in terms of software and hardware, the overall trend is very significant. PC and mobile brands, chip ...
EDN

Thermal analysis tool aims to reinvigorate 3D-IC design

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...
Design-Reuse

SpringSoft and TSMC Commence Joint Development of Multi-Node Process Design Kit Portfolio

Long-Term Collaboration Supports Industry Transition to Interoperable PDK; First Development Milestone Delivers SpringSoft Laker 65nm CMOS PDK HSINCHU, Taiwan -- June 22, 2009 -- SpringSoft, Inc.
Electronic Design

AI Lends a Helping Hand with Analog and Custom IC Design

Skilled engineers remain the driving force for innovation in chips. But it’s no secret that electronic design automation (EDA) companies are folding AI into more of their offerings to speed up design ...
Digi Times

Cadence and Saigon High-Tech Park collaborate to nurture next generation of IC design expertise in Vietnam

Cadence Design Systems, Inc. (Nasdaq: CDNS) and Saigon High-Tech Park (SHTP), the leading high-tech hub in Vietnam, today announced a collaboration to foster electronic design expertise and advance ...