Explore the latest news, products, and insights in electronics engineering, embedded systems, VLSI, and semiconductor industries on EE Herald.
Hong Kong based AAC Technologies has announced the completion of the acquisition of WiSpry. WiSpry makes tunable radio frequency (“RF”) semiconductor products for the wireless industry and also RF ...
Tektronix' partner Nexus Technology has developed MCA4000 protocol compliance and bus protocol analyzer for faster protocol, performance and compliance analysis of JEDEC DDR4, DDR3 and DDR3L DRAM ...
Keeping eye on growing importance of Bluetooth in ultra low-power systems such as wearables, CPU IP vendor ARM has acquired Wicentric, a Bluetooth Smart stack and profile provider, and Sunrise Micro ...
Bourns, introduced four new multilayer chip inductor series: CE0603G, CE0603M, CE1005Q, and CE1608Q. The inductors feature a monolithic structure created through advanced multilayer technology. They ...
The new XJFlash from XJTAG allows you to automatically generate customized programming solution for the flash devices connected to FPGAs on your board. XJFlash automatically generate a custom design ...
Intel started volume production of finFET based 14nm semiconductor wafers. Intel's 14nm Core M processor architecture powered gadgets are going to hit the market during the Christmas and year-end ...
Cadence announced today that Entuple Technologies Pvt Ltd has been appointed as a Cadence Channel Partner in India as a value-added reseller (VAR) for the university segment. Cadence has selected ...
Analog integrated circuits form the backbone of countless electronic systems, serving as the essential interface between the physical world and digital processing systems. From precision sensors that ...
Forte Design Systems is partnering with CircuitSutra to provide VLSI design services throughout India. Forte and CircuitSutra to co-develop ARM AMBA AXI and OCP-IP models compatible with Forte's ...
QuickLogic announced its selection by a large multi-national company for eFPGA IP targeting the TSMC N12e, 12nm process. IP delivery for this contract is scheduled for fiscal year 2024. This design is ...
Semiconductor research organisation CEA-Leti presented a paper on how to Stack transistor sequentially in the same process flow for 3D-VLSI, at ongoing semiconductor manufacturing technology IEDM 2014 ...
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