Abstract: In this study, an advanced 2.3D solution was proposed to integrate RDL interposer and FR-4 substrate using the technique of hybrid soldering, which applies printing of epoxy solder paste to ...
Abstract: We propose a proof-of-concept augmented reality assembly tutorial application that uses a video-see-through headset to guide the user through assembly instruction steps. It is solely ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback