Abstract: The development of semiconductors, driven by artificial intelligence (AI) and fifth-generation technology (5G) technologies, has posed challenges in advanced packaging. To address these ...

Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and 2nm capacity is ...

Abstract: As high-speed digital systems require faster transmission and computing speed, the impact of complex interconnects in a limited space on the electrical performance of the channel-link system ...

POET Technologies sits at the center of the AI-driven data center transformation with its patented optical interposer platform. POET's technology enables faster, cheaper, and more energy-efficient ...

I have a drawer full of USB cables and every time I want to connect a device, I have to try them out. USB-C was supposed to simplify things: One cable for everything, that was the promise. In practice ...