CXL L0p demystified; DRC then and now; LLVM updates; where 6G and AI converge; just-in-time supply chains break down.

Hydrogel NAND gate; long-distance remote epitaxy; PAM-8 receiver.

A new technical paper titled “Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal ...

A new technical paper titled “Toward Open-Source Chiplets for HPC and AI: Occamy and Beyond” was published by researchers at ...

A new technical paper titled “Directed self-assembly of 3D interconnected networks” was published by researchers at MIT. Abstract: “Directed self-assembly (DSA) of block copolymers (BCPs) has long ...

Designing resilient chips with SLM can help combat aging effects, security threats, and get to market faster with higher ...

A new technical paper titled “A Comparative Study of Digital Memristor-Based Processing-In-Memory from a Device and Reliability Perspective” was published by researchers at Northwestern University and ...

Growing use cases include life science AI, reducing memory and I/O bottlenecks, data prepping, wireless networking, and as ...

One of Jim’s strongest convictions is how open ecosystems like RISC-V and Atlas are what create real progress. In his words, ...

3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...

To address these challenges head-on, Siemens EDA offers the Calibre IP Checker, part of the Calibre Pattern Matching tool ...

Current Degradation in Ultra-Scaled Nanosheet FETs with S/D Underlap Doping” was published by researchers at Global TCAD ...