Developing embedded software is an increasingly complex problem. As the world moves to multi-core, multi-architecture devices, software engineers need to leverage and debug different processing ...

S-parameters describe the fundamental characteristics of RF networks, and their main types include small signal, large signal, pulsed, cold, and mixed-mode S-parameters. This article continues a ...

电路中的噪声通常都是有害的，任何好电路都应该输出尽可能低的噪声。尽管如此，在某些情况下，一个特性明确且没有其他信号的噪声源就是所需的输出。 电路特性测量就是这种情况。

Today’s designs require an increasing number of power rails and supply solutions in electronics systems, with loads ranging from a few mA for standby supplies to over 100A for ASIC voltage regulators.

Serial peripheral interface (SPI) is one of the most widely used interfaces between microcontroller and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. This article ...

One common method for determining the tilt or inclination of a system is to integrate the output of a gyroscope. Although this method is straightforward, error ...

The phenomenon of current noise increasing with frequency is well known to IC design engineers and circuit designers, but it was elusive to many engineers as a result of either too few articles in the ...

Q: ADI has published a lot of information on dealing with capacitive loading and other stability issues in books, such as the amplifier seminar series, in earlier issues of Analog Dialogue, and in ...

An electrocardiogram (ECG) is a recording of the electrical activity on the body surface generated by the heart. ECG measurement information is collected by skin electrodes placed at designated ...

For a human, experiencing a fall unobserved can be doubly dangerous. The obvious possibility of initial injury may be further aggravated by the possible consequences if treatment is not obtained ...

Many industries are calling for electronics that can operate reliably in harsh environments, including extremely high temperatures. Traditionally, engineers had to rely on active or passive cooling ...

This application note provides design and manufacturing guidance in the use of the lead frame chip scale package (LFCSP). The LFCSP is compliant with JEDEC MO220 and MO229 outlines. The LFCSP is a ...