Summary Qualcomm secured a legal victory against Arm Holdings, with jurors finding no breach of a chip technology license tied to Qualcomm's $1.4 billion Nuvia acquisition. However, Arm plans to seek ...
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market: Summary TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask pr ...
The Cutting-Edge Design Scheme Behind HBM3E's Success: Summary SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances ...
The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks. The investigation may lead to ...
Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...
Summary WeEn Semiconductor introduces top-side-cooling SiC devices in TSPAK and TOLT packages, reducing thermal resistance by 17%-19%. These innovative components boost performance, cut costs, and ...
Summary The Biden administration launched a probe into Chinese-made legacy semiconductors, citing national security risks and unfair subsidies. The investigation may lead to tariffs or import ...
Samsung Electronics and Texas Instruments finalized agreements for billions in US government funding under the CHIPS Act, boosting domestic semiconductor production. Samsung will receive $4.75 billion ...
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