Abstract: As the development speed of Moore's Law slows down, advanced packaging has emerged as a pivotal approach to enhancing chip performance, yet the accompanying thermal management challenges ...
Abstract: System in package (SiP) technology provides new development for microwave modules of improving package density and integration level. In this paper, the process flow of package-on-package ...
CHANDLER, Ariz., Oct. 21, 2025 (GLOBE NEWSWIRE) -- As connectivity standards and market needs evolve, upgradeability has become essential for extending device lifecycles, minimizing redesigns and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback