Through this collaboration, automakers choosing SPARQ OS platform can now offer Cobalt Link+, VNC Automotive’s cutting-edge solution that seamlessly integrates smartphone functionality into the ...

P3 and VNC Automotive join forces to enable seamless integration of consumers’ favorite phone standards, brings Apple ...

Discover when outsourcing beats vertical integration in reducing costs and boosting efficiency. Learn which strategy aligns ...

According to @godofprompt on Twitter, a comparative prompt was issued to ChatGPT 5.1, Claude Opus 4.5, and DeepSeek-V3.2 to generate a single HTML file implementing a realistic cloth simulation using ...

OpenAI today said that it has acquired Software Applications Incorporated and its AI app, Sky. Software Applications Incorporated and Sky were created by a team of former Apple employees known for ...

OpenAI has acquired Software Applications Incorporated (SAI), perhaps best known for the core team that produced what became Shortcuts on Apple platforms. More recently, the team has been working on ...

During carcinogenesis, the HPV genome integrates into the host genome, often disrupting the E2 gene, which normally suppresses E6 and E7 expression. HPV integration can occur randomly in the host ...

Just 5% of enterprise customers are profiting from generative AI. A bottom-up versus top-down approach can improve implementation success. AI companies are making big promises in a bubble, most of ...

Students continue to pursue postsecondary education—particularly Latino and Black students—and a growing share of those applicants are choosing to submit SAT and ACT scores even when institutions are ...

Lessons from cloud kitchens and other new business models. by Antonio Moreno For four decades advances in information technology have allowed companies to increasingly “unbundle” their operations and ...

BURLINGTON, Mass.--(BUSINESS WIRE)--Veracode, a global leader in application risk management, today announced a partnership with leading cloud security provider, Wiz, joining the Wiz Integration (WIN) ...

A new technical paper titled “Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, TEL, SK hynix, and University of ...