Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a processor’s compute modules atop a common base layer, or interposer. The interposer is itself a semiconductor that allows data to move between the chip’s other components.

Unlike past SoCs, Apple is reportedly planning to separate the CPU and GPU in its upcoming M-series chips to take advantage of TSMC's latest chip-packaging technology, known as SoIC-mH.

Apple's powerful SoC — "system on a chip" — processors have been the source of its greatness for years, bringing incredible performance and long-lasting battery life to iPhones, iPads, and Macs because they use far less power processing everything we do on a laptop.

Apple is set to revolutionise its chip design in 2025, with a major shift separating the CPU and GPU in the upcoming M5 series, according to Ming-Chi Kuo.

One of the key elements of Apple’s A-series and M-series chips is the System-on-a-Chip (SoC) design which tightly integrates